Photovoltaic module frontsheet and backsheet

ABSTRACT

A photovoltaic module includes at least one solar cell, an encapsulant encapsulating the at least one solar cell, a frontsheet juxtaposed with the encapsulant, and backsheet juxtaposed with the encapsulant. The frontsheet includes a glass layer, a polymer layer attached to the glass layer, and an adhesive layer attaching the polymer layer to the glass layer. The backsheet includes a single-layer, moisture-resistant, fire-retardant membrane.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Section 111(a) application relating to andclaiming the benefit of commonly-owned, U.S. Provisional PatentApplication Ser. No. 63/018,003, filed Apr. 30, 2020, entitled“PHOTOVOLTAIC MODULE FRONTSHEET,” commonly-owned, U.S. ProvisionalPatent Application Ser. No. 63/111,196, filed Nov. 9, 2020, entitled“PHOTOVOLTAIC MODULE FRONTSHEET,” and commonly-owned, U.S. ProvisionalPatent Application Ser. No. 63/018,013, filed Apr. 30, 2020, entitled“PHOTOVOLTAIC MODULE BACKSHEET the contents of each of which isincorporated herein by reference in its entirety.

FIELD OF THE INVENTION

The present invention relates to photovoltaic modules and, moreparticularly, frontsheets and backsheets for photovoltaic modules.

BACKGROUND OF THE INVENTION

Photovoltaic systems having solar panels are commonly installed onroofing of structures. What is needed is a photovoltaic modulefrontsheet and backsheet that enhance the features and performance ofthe photovoltaic modules.

SUMMARY OF THE INVENTION

In an embodiment, a photovoltaic module includes at least one solarcell; an encapsulant encapsulating the at least one solar cell; and afrontsheet juxtaposed with the encapsulant, wherein the frontsheetincludes a glass layer, and a polymer layer attached to the glass layer.In an embodiment, the polymer layer is attached to the glass layer by anadhesive layer. In an embodiment, the adhesive layer is selected fromthe group consisting of polyvinyl butyrate, acrylic, silicone, andpolycarbonate adhesives. In an embodiment, the adhesive layer isselected from the group consisting of thermosetting polyolefin,thermosetting polyolefin encapsulant material, thermosettingethylene-vinyl acetate (EVA), EVA encapsulants, thermoplastic olefin,thermoplastic polyolefin (TPO) and hybrids and combinations thereof. Inan embodiment, the adhesive layer includes a thermosetting polyolefinencapsulant material.

In an embodiment, the adhesive layer includes a thickness of 1 μm to 900μm. In an embodiment, the polymer layer is thermally bonded to the glasslayer. In an embodiment, the polymer layer includes a fluoropolymer. Inan embodiment, the fluoropolymer is selected from the group consistingof ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF),tetrafluoroethylene-hexafluoropropylene copolymers (FEP),tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymers(THV), polyvinyl fluoride (PVF), and blends thereof. In an embodiment,the polymer layer includes a material selected from the group consistingof acrylics, polyesters, silicones, and polycarbonates. In anembodiment, the polymer layer includes a crosslinked polymeric material.

In an embodiment, the glass layer includes a thickness of 2.5 mm to 4mm. In an embodiment, the polymer layer includes a thickness of 0.025 mmto 0.1 mm. In an embodiment, the photovoltaic module further includes abacksheet juxtaposed with the encapsulant. In an embodiment, thebacksheet includes thermoplastic polyolefin (TPO). In an embodiment, thephotovoltaic module is configured to be installed on a roof deck.

In an embodiment, a photovoltaic module includes at least one solarcell; an encapsulant encapsulating the at least one solar cell; and abacksheet juxtaposed with the encapsulant, and wherein the backsheetincludes a moisture-resistant, fire-retardant membrane. In anembodiment, the membrane includes thermoplastic polyolefin (TPO). In anembodiment, the membrane includes polyvinyl chloride. In an embodiment,the membrane includes ethylene propylene diene monomer (EPDM) rubber. Inan embodiment, the membrane includes a flame retardant additive selectedfrom the group consisting of clays, nanoclays, silicas, carbon black,metal hydroxide, metal foils, graphite, and combinations thereof. In anembodiment, the backsheet includes a water vapor transmission rate in arange of 0.01 U.S. perm to 0.05 U.S. perm.

In an embodiment, the moisture-resistant, fire-retardant membrane is thesole fire-retardant layer in the photovoltaic module. In an embodiment,the membrane includes a first ply and a second ply. In an embodiment,the membrane includes a scrim intermediate the first ply and the secondply. In an embodiment, the scrim is made from a material selected fromthe group consisting of polyesters, polyethylene, carbon fiber,fiberglass, aramids, and combinations thereof. In an embodiment, thephotovoltaic module is configured to be installed on a roof deck.

In an embodiment, a photovoltaic module includes at least one solarcell; an encapsulant; and a backsheet, wherein the backsheet includes amoisture-resistant, fire-retardant membrane, wherein the encapsulant andthe backsheet form a single, hybrid layer, and wherein the hybrid layerencapsulates the at least one solar cell. In an embodiment, the hybridlayer encapsulates 50% to 100% of an exterior surface area of the atleast one solar cell.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of an embodiment of a photovoltaic module;

FIG. 2 is an embodiment of a photovoltaic module; and

FIG. 3 is an embodiment of a photovoltaic module backsheet.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, in an embodiment, a photovoltaic module 10includes at least one solar cell 12, an encapsulant 14 encapsulating theat least one solar cell 12, and a frontsheet 16 juxtaposed with theencapsulant 14. As used herein, the terms “encapsulating” and“encapsulates” mean to partially or fully envelope or enclose, and withrespect to certain embodiments of the photovoltaic module 10, the atleast one solar cell 12 is fully enveloped by or enclosed within theencapsulant 14, or partially enveloped by or enclosed within theencapsulant 14.

In an embodiment, the encapsulant 14 encapsulates 50% to 99.9% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 55% to 99.9% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 99.9% of an exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 65% to 99.9% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, the encapsulant14 encapsulates 70% to 99.9% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 75% to 99.9% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 80% to 99.9% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 85% to 99.9% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 90% to 99.9% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 95% to 99.9% of an exterior surface area of the at leastone solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 95% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 55% to 95% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 95% of an exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 65% to 95% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, the encapsulant14 encapsulates 70% to 95% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 75% to 95% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant 14 encapsulates80% to 95% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant 14 encapsulates 85% to 95% ofan exterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 90% to 95% of an exteriorsurface area of the at least one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 90% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 55% to 90% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 90% of an exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 65% to 90% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, the encapsulant14 encapsulates 70% to 90% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 75% to 90% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant 14 encapsulates80% to 90% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant 14 encapsulates 85% to 90% ofan exterior surface area of the at least one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 85% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 55% to 85% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 85% of an exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 65% to 85% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, the encapsulant14 encapsulates 70% to 85% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 75% to 85% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant 14 encapsulates80% to 85% of an exterior surface area of the at least one solar cell12.

In another embodiment, the encapsulant 14 encapsulates 50% to 80% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 55% to 80% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 80% of an exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 65% to 80% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, the encapsulant14 encapsulates 70% to 80% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 75% to 80% of an exterior surface area of the at least onesolar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 75% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 55% to 75% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 75% of an exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 65% to 75% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, the encapsulant14 encapsulates 70% to 75% of an exterior surface area of the at leastone solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 70% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 55% to 70% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 70% of an exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 65% to 70% of an exterior surface area ofthe at least one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 65% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 55% to 65% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 65% of an exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 50% to 60% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, the encapsulant14 encapsulates 55% to 60% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 60% of an exterior surface area of the at least onesolar cell 12.

In an embodiment, the encapsulant 14 encapsulates 50% of an exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 55% of the exterior surface area of theat least one solar cell 12. In another embodiment, the encapsulant 14encapsulates 60% of the exterior surface area of the at least one solarcell 12. In another embodiment, the encapsulant 14 encapsulates 65% ofthe exterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 70% of the exterior surfacearea of the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 75% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 80% of the exterior surface area of the at least one solarcell 12. In another embodiment, the encapsulant 14 encapsulates 85% ofthe exterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 90% of the exterior surfacearea of the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 95% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 100% of the exterior surface area of the at least one solarcell 12.

In an embodiment, the photovoltaic module 10 is adapted to be attachedto a roof deck 100. In an embodiment, the at least one solar cell 12includes a plurality of solar cells 12. In an embodiment, theencapsulant 14 includes a first layer 15 having a first surface 18 and asecond layer 17 having a second surface 20. In an embodiment, thefrontsheet 16 is juxtaposed with the first surface 18 of the first layer15 of the encapsulant 14. In an embodiment, the encapsulant 14 may bemade from polyolefins, ethyl vinyl acetates, ionomers, silicones, polyvinyl butyral, epoxies, polyurethanes, or combinations/hybrids thereof.In an embodiment, the encapsulant 14 is made from thermosettingpolyolefin.

In an embodiment, the encapsulant 14 includes a thickness of 0.4 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 0.4 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 0.4 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 0.4 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.4 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.4 mm to 1.3 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.4 mmto 1.2 mm. In another embodiment, the encapsulant 14 includes athickness of 0.4 mm to 1.1 mm. In another embodiment, the encapsulant 14includes a thickness of 0.4 mm to 1.0 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.4 mm to 0.9 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.4 mm to 0.8 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.4 mmto 0.7 mm. In another embodiment, the encapsulant 14 includes athickness of 0.4 mm to 0.6 mm. In another embodiment, the encapsulant 14includes a thickness of 0.4 mm to 0.5 mm.

In an embodiment, the encapsulant 14 includes a thickness of 0.5 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 0.5 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 0.5 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 0.5 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.5 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.5 mm to 1.3 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.5 mmto 1.2 mm. In another embodiment, the encapsulant 14 includes athickness of 0.5 mm to 1.1 mm. In another embodiment, the encapsulant 14includes a thickness of 0.5 mm to 1.0 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.5 mm to 0.9 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.5 mm to 0.8 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.5 mmto 0.7 mm. In another embodiment, the encapsulant 14 includes athickness of 0.5 mm to 0.6 mm.

In an embodiment, the encapsulant 14 includes a thickness of 0.6 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 0.6 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 0.6 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 0.6 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.6 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.6 mm to 1.3 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.6 mmto 1.2 mm. In another embodiment, the encapsulant 14 includes athickness of 0.6 mm to 1.1 mm. In another embodiment, the encapsulant 14includes a thickness of 0.6 mm to 1.0 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.6 mm to 0.9 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.6 mm to 0.8 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.6 mmto 0.7 mm.

In an embodiment, the encapsulant 14 includes a thickness of 0.7 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 0.7 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 0.7 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 0.7 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.7 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.7 mm to 1.3 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.7 mmto 1.2 mm. In another embodiment, the encapsulant 14 includes athickness of 0.7 mm to 1.1 mm. In another embodiment, the encapsulant 14includes a thickness of 0.7 mm to 1.0 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.7 mm to 0.9 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.7 mm to 0.8 mm.

In an embodiment, the encapsulant 14 includes a thickness of 0.8 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 0.8 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 0.8 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 0.8 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.8 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.8 mm to 1.3 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.8 mmto 1.2 mm. In another embodiment, the encapsulant 14 includes athickness of 0.8 mm to 1.1 mm. In another embodiment, the encapsulant 14includes a thickness of 0.8 mm to 1.0 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.8 mm to 0.9 mm.

In an embodiment, the encapsulant 14 includes a thickness of 0.9 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 0.9 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 0.9 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 0.9 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 0.9 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 0.9 mm to 1.3 mm.In another embodiment, the encapsulant 14 includes a thickness of 0.9 mmto 1.2 mm. In another embodiment, the encapsulant 14 includes athickness of 0.9 mm to 1.1 mm. In another embodiment, the encapsulant 14includes a thickness of 0.9 mm to 1.0 mm.

In an embodiment, the encapsulant 14 includes a thickness of 1.0 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 1.0 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 1.0 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 1.0 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 1.0 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 1.0 mm to 1.3 mm.In another embodiment, the encapsulant 14 includes a thickness of 1.0 mmto 1.2 mm. In another embodiment, the encapsulant 14 includes athickness of 1.0 mm to 1.1 mm.

In an embodiment, the encapsulant 14 includes a thickness of 1.1 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 1.1 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 1.1 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 1.1 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 1.1 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 1.1 mm to 1.3 mm.In another embodiment, the encapsulant 14 includes a thickness of 1.1 mmto 1.2 mm.

In an embodiment, the encapsulant 14 includes a thickness of 1.2 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 1.2 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 1.2 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 1.2 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 1.2 mm to 1.4 mm. In anotherembodiment, the encapsulant 14 includes a thickness of 1.2 mm to 1.3 mm.

In an embodiment, the encapsulant 14 includes a thickness of 1.3 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 1.3 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 1.3 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 1.3 mm to 1.5 mm. In another embodiment, theencapsulant 14 includes a thickness of 1.3 mm to 1.4 mm.

In an embodiment, the encapsulant 14 includes a thickness of 1.4 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 1.4 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 1.4 mm to 1.6 mm. In another embodiment, the encapsulant14 includes a thickness of 1.4 mm to 1.5 mm.

In an embodiment, the encapsulant 14 includes a thickness of 1.5 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 1.5 mm to 1.7 mm. In another embodiment, the encapsulant 14 includesa thickness of 1.5 mm to 1.6 mm.

In an embodiment, the encapsulant 14 includes a thickness of 1.6 mm to1.8 mm. In another embodiment, the encapsulant 14 includes a thicknessof 1.6 mm to 1.7 mm. In an embodiment, the encapsulant 14 includes athickness of 1.7 mm to 1.8 mm.

In an embodiment, the encapsulant 14 includes a thickness of 0.4 mm. Inan embodiment, the encapsulant 14 includes a thickness of 0.5 mm. In anembodiment, the encapsulant 14 includes a thickness of 0.6 mm. In anembodiment, the encapsulant 14 includes a thickness of 0.7 mm. In anembodiment, the encapsulant 14 includes a thickness of 0.8 mm. In anembodiment, the encapsulant 14 includes a thickness of 0.9 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.0 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.1 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.2 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.3 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.4 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.5 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.6 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.7 mm. In anembodiment, the encapsulant 14 includes a thickness of 1.8 mm.

In an embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.2 mm to 0.9 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.2 mm to 0.8 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.2 mm to 0.7 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.2 mm to 0.6 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.2 mm to 0.5 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.2 mm to 0.4 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.2 mm to 0.3 mm.

In an embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.3 mm to 0.9 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.3 mm to 0.8 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.3 mm to 0.7 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.3 mm to 0.6 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.3 mm to 0.5 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.3 mm to 0.4 mm.

In an embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.4 mm to 0.9 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.4 mm to 0.8 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.4 mm to 0.7 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.4 mm to 0.6 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.4 mm to 0.5 mm.

In an embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.5 mm to 0.9 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.5 mm to 0.8 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.5 mm to 0.7 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.5 mm to 0.6 mm. In anembodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.6 mm to 0.9 mm. In another embodiment, the first layer 15of the encapsulant 14 includes a thickness of 0.6 mm to 0.8 mm. Inanother embodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.6 mm to 0.7 mm. In an embodiment, the first layer 15 ofthe encapsulant 14 includes a thickness of 0.7 mm to 0.9 mm. In anotherembodiment, the first layer 15 of the encapsulant 14 includes athickness of 0.7 mm to 0.8 mm. In an embodiment, the first layer 15 ofthe encapsulant 14 includes a thickness of 0.8 mm to 0.9 mm.

In an embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.2 mm to 0.9 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.2 mm to 0.8 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.2 mm to 0.7 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.2 mm to 0.6 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.2 mm to 0.5 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.2 mm to 0.4 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.2 mm to 0.3 mm.

In an embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.3 mm to 0.9 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.3 mm to 0.8 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.3 mm to 0.7 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.3 mm to 0.6 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.3 mm to 0.5 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.3 mm to 0.4 mm.

In an embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.4 mm to 0.9 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.4 mm to 0.8 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.4 mm to 0.7 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.4 mm to 0.6 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.4 mm to 0.5 mm.

In an embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.5 mm to 0.9 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.5 mm to 0.8 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.5 mm to 0.7 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.5 mm to 0.6 mm. In anembodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.6 mm to 0.9 mm. In another embodiment, the second layer17 of the encapsulant 14 includes a thickness of 0.6 mm to 0.8 mm. Inanother embodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.6 mm to 0.7 mm. In an embodiment, the second layer 17 ofthe encapsulant 14 includes a thickness of 0.7 mm to 0.9 mm. In anotherembodiment, the second layer 17 of the encapsulant 14 includes athickness of 0.7 mm to 0.8 mm. In an embodiment, the second layer 17 ofthe encapsulant 14 includes a thickness of 0.8 mm to 0.9 mm.

In an embodiment, the thickness of the first layer 15 is equal to thethickness of the second layer 17. In another embodiment, the thicknessof the first layer 15 is different from the thickness of the secondlayer 17.

Referring to FIG. 1, in an embodiment, the frontsheet 16 includes aglass layer 22 having a first surface 24 and a second surface 26opposite the first surface 24 of the glass layer 22, and a polymer layer28 attached to the first surface 24 of the glass layer 22. In anembodiment, the second surface 26 of the glass layer 22 is juxtaposedwith the first surface 18 of the encapsulant 14. In an embodiment, eachof the glass layer 22 and the polymer layer 28 is transparent. In anembodiment, the polymer layer 28 is attached to the glass layer 22 by anadhesive layer 30. In an embodiment, the adhesive layer 30 may includepolyvinyl butyrate, acrylic, silicone, or polycarbonate. In anotherembodiment, the adhesive layer 30 may include pressure sensitiveadhesives. In another embodiment, the polymer layer 28 is attached tothe glass layer 22 by thermal bonding. In another embodiment, thefrontsheet 16 includes at least one of the glass layer 22 or the polymerlayer 28.

In an embodiment, the adhesive layer 30 includes thermosettingpolyolefin, thermosetting polyolefin encapsulant material, thermosettingethylene-vinyl acetate (EVA), EVA encapsulants, thermoplastic olefin,thermoplastic polyolefin (TPO) or hybrids/combinations thereof.

In an embodiment, the adhesive layer 30 includes a thickness of 1 μm to900 μm. In an embodiment, the adhesive layer 30 includes a thickness of1 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 1 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 1 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 1 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 1 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 1 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 1 μmto 550 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 1 μm to 500 μm. In an embodiment, the adhesive layer 30 includes athickness of 1 μm to 450 μm. In an embodiment, the adhesive layer 30includes a thickness of 1 μm to 400 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 1 μm to 350 μm. In an embodiment, theadhesive layer 30 includes a thickness of 1 μm to 300 μm. In anembodiment, the adhesive layer 30 includes a thickness of 1 μm to 250μm. In an embodiment, the adhesive layer 30 includes a thickness of 1 μmto 200 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 1 μm to 150 μm. In an embodiment, the adhesive layer 30 includes athickness of 1 μm to 100 μm. In an embodiment, the adhesive layer 30includes a thickness of 1 μm to 50 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 50 μm to900 μm. In an embodiment, the adhesive layer 30 includes a thickness of50 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 50 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 50 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 50 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 50 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 50 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 50μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 50 μm to 500 μm. In an embodiment, the adhesive layer 30includes a thickness of 50 μm to 450 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 50 μm to 400 μm. In an embodiment, theadhesive layer 30 includes a thickness of 50 μm to 350 μm. In anembodiment, the adhesive layer 30 includes a thickness of 50 μm to 300μm. In an embodiment, the adhesive layer 30 includes a thickness of 50μm to 250 μm. In an embodiment, the adhesive layer 30 includes athickness of 50 μm to 200 μm. In an embodiment, the adhesive layer 30includes a thickness of 50 μm to 150 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 50 μm to 100 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 100 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 100 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 100 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 100 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 100 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 100 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 100 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 100μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 100 μm to 500 μm. In an embodiment, the adhesive layer 30includes a thickness of 100 μm to 450 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 100 μm to 400 μm. In an embodiment, theadhesive layer 30 includes a thickness of 100 μm to 350 μm. In anembodiment, the adhesive layer 30 includes a thickness of 100 μm to 300μm. In an embodiment, the adhesive layer 30 includes a thickness of 100μm to 250 μm. In an embodiment, the adhesive layer 30 includes athickness of 100 μm to 200 μm. In an embodiment, the adhesive layer 30includes a thickness of 100 μm to 150 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 150 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 150 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 150 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 150 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 150 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 150 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 150 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 150μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 150 μm to 500 μm. In an embodiment, the adhesive layer 30includes a thickness of 150 μm to 450 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 150 μm to 400 μm. In an embodiment, theadhesive layer 30 includes a thickness of 150 μm to 350 μm. In anembodiment, the adhesive layer 30 includes a thickness of 150 μm to 300μm. In an embodiment, the adhesive layer 30 includes a thickness of 150μm to 250 μm. In an embodiment, the adhesive layer 30 includes athickness of 150 μm to 200 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 200 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 200 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 200 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 200 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 200 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 200 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 200 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 200μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 200 μm to 500 μm. In an embodiment, the adhesive layer 30includes a thickness of 200 μm to 450 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 200 μm to 400 μm. In an embodiment, theadhesive layer 30 includes a thickness of 200 μm to 350 μm. In anembodiment, the adhesive layer 30 includes a thickness of 200 μm to 300μm. In an embodiment, the adhesive layer 30 includes a thickness of 200μm to 250 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 250 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 250 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 250 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 250 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 250 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 250 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 250 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 250μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 250 μm to 500 μm. In an embodiment, the adhesive layer 30includes a thickness of 250 μm to 450 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 250 μm to 400 μm. In an embodiment, theadhesive layer 30 includes a thickness of 250 μm to 350 μm. In anembodiment, the adhesive layer 30 includes a thickness of 250 μm to 300μm.

In an embodiment, the adhesive layer 30 includes a thickness of 300 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 300 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 300 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 300 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 300 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 300 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 300 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 300μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 300 μm to 500 μm. In an embodiment, the adhesive layer 30includes a thickness of 300 μm to 450 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 300 μm to 400 μm. In an embodiment, theadhesive layer 30 includes a thickness of 300 μm to 350 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 350 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 350 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 350 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 350 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 350 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 350 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 350 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 350μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 350 μm to 500 μm. In an embodiment, the adhesive layer 30includes a thickness of 350 μm to 450 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 350 μm to 400 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 400 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 400 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 400 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 400 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 400 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 400 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 400 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 400μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 400 μm to 500 μm. In an embodiment, the adhesive layer 30includes a thickness of 400 μm to 450 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 450 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 450 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 450 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 450 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 450 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 450 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 450 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 450μm to 550 μm. In an embodiment, the adhesive layer 30 includes athickness of 450 μm to 500 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 500 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 500 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 500 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 500 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 500 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 500 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 500 μm to 600μm. In an embodiment, the adhesive layer 30 includes a thickness of 500μm to 550 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 550 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 550 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 550 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 550 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 550 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 550 μm to 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 550 μm to 600μm.

In an embodiment, the adhesive layer 30 includes a thickness of 600 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 600 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 600 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 600 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 600 μm to 700 μm. In an embodiment, theadhesive layer 30 includes a thickness of 600 μm to 650 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 650 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 650 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 650 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 650 μm to 750 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 650 μm to 700 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 700 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 700 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 700 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 700 μm to 750 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 750 μmto 900 μm. In an embodiment, the adhesive layer 30 includes a thicknessof 750 μm to 850 μm. In an embodiment, the adhesive layer 30 includes athickness of 750 μm to 800 μm. In an embodiment, the adhesive layer 30includes a thickness of 800 μm to 900 μm. In an embodiment, the adhesivelayer 30 includes a thickness of 800 μm to 850 μm. In an embodiment, theadhesive layer 30 includes a thickness of 850 μm to 900 μm.

In an embodiment, the adhesive layer 30 includes a thickness of 1 μm. Inan embodiment, the adhesive layer 30 includes a thickness of 50 μm. Inan embodiment, the adhesive layer 30 includes a thickness of 100 μm. Inan embodiment, the adhesive layer 30 includes a thickness of 1 μm. In anembodiment, the adhesive layer 30 includes a thickness of 150 μm. In anembodiment, the adhesive layer 30 includes a thickness of 200 μm. In anembodiment, the adhesive layer 30 includes a thickness of 250 μm. In anembodiment, the adhesive layer 30 includes a thickness of 300 μm. In anembodiment, the adhesive layer 30 includes a thickness of 350 μm. In anembodiment, the adhesive layer 30 includes a thickness of 400 μm. In anembodiment, the adhesive layer 30 includes a thickness of 450 μm. In anembodiment, the adhesive layer 30 includes a thickness of 500 μm. In anembodiment, the adhesive layer 30 includes a thickness of 550 μm. In anembodiment, the adhesive layer 30 includes a thickness of 600 μm. In anembodiment, the adhesive layer 30 includes a thickness of 650 μm. In anembodiment, the adhesive layer 30 includes a thickness of 700 μm. In anembodiment, the adhesive layer 30 includes a thickness of 750 μm. In anembodiment, the adhesive layer 30 includes a thickness of 800 μm. In anembodiment, the adhesive layer 30 includes a thickness of 850 μm. In anembodiment, the adhesive layer 30 includes a thickness of 900 μm.

In an embodiment, the adhesive layer 30 includes a single layer. Inanother embodiment, the adhesive layer 30 includes a plurality oflayers.

In an embodiment, the polymer layer 28 includes a fluoropolymer. Incertain embodiments, the fluoropolymer may be ethylenetetrafluoroethylene (ETFE), fluoropolymer is polyvinylidene fluoride(PVDF), tetrafluoroethylene-hexafluoropropylene copolymers (FEP), andtetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymers(THV), polyvinyl fluoride (PVF), or blends thereof. In an embodiment,the polymer layer 28 includes fluoropolymers, acrylics, polyesters,silicones, polycarbonates, or combinations thereof. In otherembodiments, the polymer layer 28 includes polyethylene terephthalate(PET), polyethylene naphthalate (PEN), polyetheretherketone (PEEK),polyaryletherketone (PAEK), polyarylate (PAR), polyetherimide (PEI),polyarylsulfone (PAS), polyethersulfone (PES), polyamideimide (PAI),polyphenylsulfone (PPSU), polyolefin, cyclic olefin copolymers (CPCs),or polyimide.

In an embodiment, the polymer layer 28 includes a crosslinked polymericmaterial. In an embodiment, 50% to 99% of the polymer chains of thepolymeric material are crosslinked. In another embodiment, 55% to 99% ofthe polymer chains of the polymeric material are crosslinked. In anotherembodiment, 60% to 99% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 65% to 99% of the polymer chainsof the polymeric material are crosslinked. In another embodiment, 70% to99% of the polymer chains of the polymeric material are crosslinked. Inanother embodiment, 75% to 99% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 80% to 99% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 85% to 99% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 90% to 99% of the polymer chainsof the polymeric material are crosslinked. In another embodiment, 95% to99% of the polymer chains of the polymeric material are crosslinked. Inanother embodiment, 50% to 95% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 50% to 90% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 50% to 85% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 50% to 80% of the polymer chainsof the polymeric material are crosslinked. In another embodiment, 50% to75% of the polymer chains of the polymeric material are crosslinked. Inanother embodiment, 50% to 70% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 50% to 65% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 50% to 60% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 50% to 55% of the polymer chainsof the polymeric material are crosslinked.

In another embodiment, 55% to 95% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 55% to 90% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 55% to 85% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 55% to 80% of the polymer chainsof the polymeric material are crosslinked. In another embodiment, 55% to75% of the polymer chains of the polymeric material are crosslinked. Inanother embodiment, 55% to 70% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 55% to 65% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 55% to 60% of the polymer chains of the polymeric materialare crosslinked.

In another embodiment, 60% to 95% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 60% to 90% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 60% to 85% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 60% to 80% of the polymer chainsof the polymeric material are crosslinked. In another embodiment, 60% to75% of the polymer chains of the polymeric material are crosslinked. Inanother embodiment, 60% to 70% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 60% to 65% of thepolymer chains of the polymeric material are crosslinked.

In another embodiment, 65% to 95% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 65% to 90% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 60% to 85% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 65% to 80% of the polymer chainsof the polymeric material are crosslinked. In another embodiment, 65% to75% of the polymer chains of the polymeric material are crosslinked. Inanother embodiment, 65% to 70% of the polymer chains of the polymericmaterial are crosslinked.

In another embodiment, 70% to 95% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 70% to 90% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 70% to 85% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 70% to 80% of the polymer chainsof the polymeric material are crosslinked. In another embodiment, 70% to75% of the polymer chains of the polymeric material are crosslinked.

In another embodiment, 75% to 95% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 75% to 90% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 75% to 85% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 75% to 90% of the polymer chainsof the polymeric material are crosslinked.

In another embodiment, 80% to 95% of the polymer chains of the polymericmaterial are crosslinked. In another embodiment, 80% to 90% of thepolymer chains of the polymeric material are crosslinked. In anotherembodiment, 80% to 85% of the polymer chains of the polymeric materialare crosslinked. In another embodiment, 85% to 95% of the polymer chainsof the polymeric material are crosslinked. In another embodiment, 85% to90% of the polymer chains of the polymeric material are crosslinked. Inanother embodiment, 90% to 95% of the polymer chains of the polymericmaterial are crosslinked.

In an embodiment, the polymeric material of the polymer layer 28 iscrosslinked by an electron beam. In another embodiment, the polymericmaterial is crosslinked by gamma radiation.

In an embodiment, the glass layer 22 includes a thickness of 2.5 mm to 4mm. In another embodiment, the glass layer 22 includes a thickness of2.5 mm to 3.5 mm. In another embodiment, the glass layer 22 includes athickness of 2.5 mm to 3 mm. In another embodiment, the glass layer 22includes a thickness of 3 mm to 4 mm. In another embodiment, the glasslayer 22 includes a thickness of 3.5 mm to 4 mm. In another embodiment,the glass layer 22 includes a thickness of 2.6 mm to 3.5 mm. In anotherembodiment, the glass layer 22 includes a thickness of 2.7 mm to 3.5 mm.In another embodiment, the glass layer 22 includes a thickness of 2.8 mmto 3.5 mm. In another embodiment, the glass layer 22 includes athickness of 2.9 mm to 3.5 mm. In another embodiment, the glass layer 22includes a thickness of 3 mm to 3.5 mm. In another embodiment, the glasslayer 22 includes a thickness of 3.1 mm to 3.5 mm. In anotherembodiment, the glass layer 22 includes a thickness of 3.2 mm to 3.5 mm.In another embodiment, the glass layer 22 includes a thickness of 3.3 mmto 3.5 mm. In another embodiment, the glass layer 22 includes athickness of 3.4 mm to 3.5 mm. In another embodiment, the glass layer 22includes a thickness of 2.5 mm to 3.4 mm. In another embodiment, theglass layer 22 includes a thickness of 2.5 mm to 3.3 mm. In anotherembodiment, the glass layer 22 includes a thickness of 2.5 mm to 3.2 mm.In another embodiment, the glass layer 22 includes a thickness of 2.5 mmto 3.1 mm. In another embodiment, the glass layer 22 includes athickness of 2.5 mm to 2.9 mm. In another embodiment, the glass layer 22includes a thickness of 2.5 mm to 2.8 mm. In another embodiment, theglass layer 22 includes a thickness of 2.5 mm to 2.7 mm. In anotherembodiment, the glass layer 22 includes a thickness of 2.5 mm to 2.6 mm.

In another embodiment, the glass layer 22 includes a thickness of 2.5mm. In another embodiment, the glass layer 22 includes a thickness of2.6 mm. In another embodiment, the glass layer 22 includes a thicknessof 2.7 mm. In another embodiment, the glass layer 22 includes athickness of 2.8 mm. In another embodiment, the glass layer 22 includesa thickness of 2.9 mm. In another embodiment, the glass layer 22includes a thickness of 3 mm. In another embodiment, the glass layer 22includes a thickness of 3.1 mm. In another embodiment, the glass layer22 includes a thickness of 3.2 mm. In another embodiment, the glasslayer 22 includes a thickness of 3.3 mm. In another embodiment, theglass layer 22 includes a thickness of 3.4 mm. In another embodiment,the glass layer 22 includes a thickness of 3.5 mm. In anotherembodiment, the glass layer 22 includes a thickness of 3.6 mm. Inanother embodiment, the glass layer 22 includes a thickness of 3.7 mm.In another embodiment, the glass layer 22 includes a thickness of 3.8mm. In another embodiment, the glass layer 22 includes a thickness of3.9 mm. In another embodiment, the glass layer 22 includes a thicknessof 4 mm.

In an embodiment, the polymer layer 28 includes a thickness of 0.01 mmto 0.5 mm. In another embodiment, the polymer layer 28 includes athickness of 0.01 mm to 0.4 mm. In another embodiment, the polymer layer28 includes a thickness of 0.01 mm to 0.3 mm. In another embodiment, thepolymer layer 28 includes a thickness of 0.01 mm to 0.2 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.01 mm to 0.1mm. In another embodiment, the polymer layer 28 includes a thickness of0.01 mm to 0.09 mm. In another embodiment, the polymer layer 28 includesa thickness of 0.01 mm to 0.08 mm. In another embodiment, the polymerlayer 28 includes a thickness of 0.01 mm to 0.07 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.01 mm to 0.06mm. In another embodiment, the polymer layer 28 includes a thickness of0.01 mm to 0.05 mm. In another embodiment, the polymer layer 28 includesa thickness of 0.01 mm to 0.04 mm. In another embodiment, the polymerlayer 28 includes a thickness of 0.01 mm to 0.03 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.01 mm to 0.02mm.

In another embodiment, the polymer layer 28 includes a thickness of 0.01mm to 0.4 mm. In another embodiment, the polymer layer 28 includes athickness of 0.02 mm to 0.4 mm. In another embodiment, the polymer layer28 includes a thickness of 0.03 mm to 0.4 mm. In another embodiment, thepolymer layer 28 includes a thickness of 0.04 mm to 0.4 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.05 mm to 0.4mm. In another embodiment, the polymer layer 28 includes a thickness of0.06 mm to 0.4 mm. In another embodiment, the polymer layer 28 includesa thickness of 0.07 mm to 0.4 mm. In another embodiment, the polymerlayer 28 includes a thickness of 0.08 mm to 0.4 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.09 mm to 0.4mm. In another embodiment, the polymer layer 28 includes a thickness of0.1 mm to 0.4 mm. In another embodiment, the polymer layer 28 includes athickness of 0.15 mm to 0.4 mm. In another embodiment, the polymer layer28 includes a thickness of 0.2 mm to 0.4 mm. In another embodiment, thepolymer layer 28 includes a thickness of 0.25 mm to 0.4 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.3 mm to 0.4mm. In another embodiment, the polymer layer 28 includes a thickness of0.35 mm to 0.4 mm.

In another embodiment, the polymer layer 28 includes a thickness of0.025 mm to 0.1 mm. In another embodiment, the polymer layer 28 includesa thickness of 0.03 mm to 0.1 mm. In another embodiment, the polymerlayer 28 includes a thickness of 0.035 mm to 0.1 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.04 mm to 0.1mm. In another embodiment, the polymer layer 28 includes a thickness of0.045 mm to 0.1 mm. In another embodiment, the polymer layer 28 includesa thickness of 0.05 mm to 0.1 mm. In another embodiment, the polymerlayer 28 includes a thickness of 0.06 mm to 0.1 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.065 mm to 0.1mm. In another embodiment, the polymer layer 28 includes a thickness of0.07 mm to 0.1 mm. In another embodiment, the polymer layer 28 includesa thickness of 0.075 mm to 0.1 mm. In another embodiment, the polymerlayer 28 includes a thickness of 0.08 mm to 0.1 mm. In anotherembodiment, the polymer layer 28 includes a thickness of 0.085 mm to 0.1mm. In another embodiment, the polymer layer 28 includes a thickness of0.09 mm to 0.1 mm. In another embodiment, the polymer layer 28 includesa thickness of 0.095 mm to 0.1 mm.

Referring to FIG. 1, in an embodiment, the photovoltaic module 10includes a backsheet 32 juxtaposed with the second surface 20 of theencapsulant 14. In an embodiment, the backsheet 32 includes a singlelayer, moisture-resistant, fire-retardant membrane 38. In an embodiment,the membrane 38 is the sole fire-retardant layer in the photovoltaicmodule 10. In an embodiment, the membrane 38 includes a first surface 34and a second surface 36 opposite the first surface 34. In an embodiment,the first surface 34 of the membrane 38 is juxtaposed with the secondsurface 20 of the encapsulant 14 and the second surface 36 of themembrane 38 is juxtaposed with the roof deck 100.

In an embodiment, the membrane 38 includes thermoplastic polyolefin(TPO). In an embodiment, the membrane 38 includes a single ply TPOroofing membrane. In other embodiments, non-limiting examples of TPOmembranes are disclosed in U.S. Pat. No. 9,359,014 to Yang et al., whichis incorporated by reference herein in its entirety.

In another embodiment, the membrane 38 includes polyvinyl chloride. Inan embodiment, the membrane 38 includes ethylene propylene diene monomer(EPDM) rubber. In an embodiment, the membrane 38 includes a flameretardant additive. In some embodiments, the flame retardant additivemay be clays, nanoclays, silicas, carbon black, metal hydroxides such asaluminum hydroxide, metal foils, graphite, and combinations thereof.

In another embodiment, the backsheet 32 includes a first ply and asecond ply. In other embodiments, the backsheet 32 includes a pluralityof layers. In other embodiments, the photovoltaic module 10 may includemore than one backsheet 32.

In an embodiment, the photovoltaic module 10 is adapted to be acomponent of a photovoltaic system that includes a fire resistance thatconforms to standards under UL 790/ASTM E 108 test standards. In anembodiment, the photovoltaic module 10 includes a Class A rating whentested in accordance with UL 790/ASTM E 108.

As used herein, the term “fire-retardant” means a material having a V-0,V-1, or V-2 rating when tested in accordance with UL 94. In anembodiment, the backsheet 32 includes a V-0 rating when tested inaccordance with UL 94. In an embodiment, the backsheet 32 includes a V-1rating when tested in accordance with UL 94. In an embodiment, thebacksheet 32 includes a V-2 rating when tested in accordance with UL 94.

As used herein, the term “moisture resistant” means having a watertransmission rate of less than or equal to 0.05 U.S. perm, as measuredby ASTM E 96, Procedure B—Standard Test Methods for Water VaporTransmission of Materials. In an embodiment, the backsheet 32 includes awater vapor transmission rate in a range between 0.01 perm and 0.05 U.S.perm. In an embodiment, the backsheet 32 includes a water vaportransmission rate in a range between 0.01 perm and 0.04 U.S. perm. In anembodiment, the backsheet 32 includes a water vapor transmission rate ina range between 0.01 perm and 0.03 U.S. perm. In an embodiment, thebacksheet 32 includes a water vapor transmission rate in a range between0.01 perm and 0.02 U.S. perm. In an embodiment, the backsheet 32includes a water vapor transmission rate in a range between 0.02 permand 0.05 U.S. perm. In an embodiment, the backsheet 32 includes a watervapor transmission rate in a range between 0.02 perm and 0.04 U.S. perm.In an embodiment, the backsheet 32 includes a water vapor transmissionrate in a range between 0.02 perm and 0.03 U.S. perm. In an embodiment,the backsheet 32 includes a water vapor transmission rate in a rangebetween 0.03 perm and 0.05 U.S. perm. In an embodiment, the backsheet 32includes a water vapor transmission rate in a range between 0.03 permand 0.04 U.S. perm. In an embodiment, the backsheet 32 includes a watervapor transmission rate in a range between 0.04 perm and 0.05 U.S. perm.

In an embodiment, the backsheet 32 includes a water vapor transmissionrate of 0.05 U.S. perm. In an embodiment, the backsheet 32 includes awater vapor transmission rate of 0.04 U.S. perm. In an embodiment, thebacksheet 32 includes a water vapor transmission rate of 0.03 U.S. perm.In an embodiment, the backsheet 32 includes a water vapor transmissionrate of 0.02 U.S. perm. In an embodiment, the backsheet 32 includes awater vapor transmission rate of 0.01 U.S. perm.

Referring to FIG. 3, in an embodiment, the membrane 38 includes a firstply 40 and a second ply 42. In an embodiment, the membrane 38 includes ascrim 44 intermediate the first ply 40 and the second ply 42. In anembodiment, the scrim 44 may be made from polyesters, polyethylene,carbon fiber, fiberglass, aramids, and combinations thereof.

In an embodiment, the backsheet 32 includes a thickness of 10 mil to 100mil. In an embodiment, the backsheet 32 includes a thickness of 10 milto 90 mil. In an embodiment, the backsheet 32 includes a thickness of 10mil to 80 mil. In an embodiment, the backsheet 32 includes a thicknessof 10 mil to 70 mil. In an embodiment, the backsheet 32 includes athickness of 10 mil to 60 mil. In an embodiment, the backsheet 32includes a thickness of 10 mil to 50 mil. In an embodiment, thebacksheet 32 includes a thickness of 10 mil to 40 mil. In an embodiment,the backsheet 32 includes a thickness of 10 mil to 30 mil. In anembodiment, the backsheet 32 includes a thickness of 10 mil to 20 mil.

In an embodiment, the backsheet 32 includes a thickness of 20 mil to 100mil. In an embodiment, the backsheet 32 includes a thickness of 20 milto 90 mil. In an embodiment, the backsheet 32 includes a thickness of 20mil to 80 mil. In an embodiment, the backsheet 32 includes a thicknessof 20 mil to 70 mil. In an embodiment, the backsheet 32 includes athickness of 20 mil to 60 mil. In an embodiment, the backsheet 32includes a thickness of 20 mil to 50 mil. In an embodiment, thebacksheet 32 includes a thickness of 20 mil to 40 mil. In an embodiment,the backsheet 32 includes a thickness of 20 mil to 30 mil.

In an embodiment, the backsheet 32 includes a thickness of 30 mil to 100mil. In an embodiment, the backsheet 32 includes a thickness of 30 milto 90 mil. In an embodiment, the backsheet 32 includes a thickness of 30mil to 80 mil. In an embodiment, the backsheet 32 includes a thicknessof 30 mil to 70 mil. In an embodiment, the backsheet 32 includes athickness of 30 mil to 60 mil. In an embodiment, the backsheet 32includes a thickness of 30 mil to 50 mil. In an embodiment, thebacksheet 32 includes a thickness of 30 mil to 40 mil.

In an embodiment, the backsheet 32 includes a thickness of 40 mil to 100mil. In an embodiment, the backsheet 32 includes a thickness of 40 milto 90 mil. In an embodiment, the backsheet 32 includes a thickness of 40mil to 80 mil. In an embodiment, the backsheet 32 includes a thicknessof 40 mil to 70 mil. In an embodiment, the backsheet 32 includes athickness of 40 mil to 60 mil. In an embodiment, the backsheet 32includes a thickness of 40 mil to 50 mil.

In an embodiment, the backsheet 32 includes a thickness of 50 mil to 100mil. In an embodiment, the backsheet 32 includes a thickness of 50 milto 90 mil. In an embodiment, the backsheet 32 includes a thickness of 50mil to 80 mil. In an embodiment, the backsheet 32 includes a thicknessof 50 mil to 70 mil. In an embodiment, the backsheet 32 includes athickness of 50 mil to 60 mil.

In an embodiment, the backsheet 32 includes a thickness of 60 mil to 100mil. In an embodiment, the backsheet 32 includes a thickness of 60 milto 90 mil. In an embodiment, the backsheet 32 includes a thickness of 60mil to 80 mil. In an embodiment, the backsheet 32 includes a thicknessof 60 mil to 70 mil.

In an embodiment, the backsheet 32 includes a thickness of 70 mil to 100mil. In an embodiment, the backsheet 32 includes a thickness of 70 milto 90 mil. In an embodiment, the backsheet 32 includes a thickness of 70mil to 80 mil.

In an embodiment, the backsheet 32 includes a thickness of 80 mil to 100mil. In an embodiment, the backsheet 32 includes a thickness of 80 milto 90 mil. In an embodiment, the backsheet 32 includes a thickness of 90mil to 100 mil.

In an embodiment, the backsheet 32 includes a thickness of 10 mil. In anembodiment, the backsheet 32 includes a thickness of 20 mil. In anembodiment, the backsheet 32 includes a thickness of 30 mil. In anembodiment, the backsheet 32 includes a thickness of 40 mil. In anembodiment, the backsheet 32 includes a thickness of 50 mil. In anembodiment, the backsheet 32 includes a thickness of 60 mil. In anembodiment, the backsheet 32 includes a thickness of 10 mil. In anembodiment, the backsheet 32 includes a thickness of 70 mil. In anembodiment, the backsheet 32 includes a thickness of 80 mil. In anembodiment, the backsheet 32 includes a thickness of 90 mil. In anembodiment, the backsheet 32 includes a thickness of 100 mil.

In an embodiment, the encapsulant 14 encapsulates 50% to 99.9% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 0.1% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 99.9% of an exterior surface area of the at leastone solar cell 12, and the backsheet 32 covers 0.1% to 45% of theexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 60% to 99.9% of an exteriorsurface area of the at least one solar cell 12, and the backsheet 32covers 0.1% to 40% of the exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant 14 encapsulates65% to 99.9% of an exterior surface area of the at least one solar cell12, and the backsheet 32 covers 0.1% to 35% of the exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 70% to 99.9% of an exterior surface area ofthe at least one solar cell 12, and the backsheet 32 covers 0.1% to 30%of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 75% to 99.9% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 0.1% to 25% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 80% to 99.9% of an exterior surface area of the at leastone solar cell 12, and the backsheet 32 covers 0.1% to 20% of theexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 85% to 99.9% of an exteriorsurface area of the at least one solar cell 12, and the backsheet 32covers 0.1% to 15% of the exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant 14 encapsulates90% to 99.9% of an exterior surface area of the at least one solar cell12, and the backsheet 32 covers 0.1% to 10% of the exterior surface areaof the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 95% to 99.9% of an exterior surface area ofthe at least one solar cell 12, and the backsheet 32 covers 0.1% to 5%of the exterior surface area of the at least one solar cell 12.

In an embodiment, the encapsulant 14 encapsulates 50% to 95% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 5% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 95% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 5% to 45% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 95% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 5% to 40%of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 65% to 95% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 5% to 35% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 70% to 95% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 5% to 30% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 75% to 95% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 5% to 25%of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 80% to 95% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 5% to 20% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 85% to 95% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 5% to 15% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 90% to 95% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 5% to 10%of the exterior surface area of the at least one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 90% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 10% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 90% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 10% to 45% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 90% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 10% to40% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 65% to 90% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 10% to 35% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 70% to 90% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 10% to 30% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 75% to 90% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 10% to25% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 80% to 90% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 10% to 20% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 85% to 90% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 10% to 15% of the exteriorsurface area of the at least one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 85% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 15% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 85% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 15% to 45% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 85% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 15% to40% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 65% to 85% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 15% to 35% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 70% to 85% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 15% to 30% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 75% to 85% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 15% to25% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 80% to 85% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 15% to 20% of the exterior surface area of the atleast one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 80% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 20% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 80% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 20% to 45% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 80% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 20% to40% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 65% to 80% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 20% to 35% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 70% to 80% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 20% to 30% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 75% to 80% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 20% to25% of the exterior surface area of the at least one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 75% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 25% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 75% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 25% to 45% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 75% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 25% to40% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 65% to 75% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 25% to 35% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 70% to 75% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 25% to 30% of the exteriorsurface area of the at least one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 70% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 30% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 70% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 30% to 45% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 70% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 30% to40% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 65% to 70% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 30% to 35% of the exterior surface area of the atleast one solar cell 12.

In another embodiment, the encapsulant 14 encapsulates 50% to 65% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 35% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 65% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 35% to 45% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 60% to 65% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 35% to40% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 50% to 60% of anexterior surface area of the at least one solar cell 12, and thebacksheet 32 covers 40% to 50% of the exterior surface area of the atleast one solar cell 12. In another embodiment, the encapsulant 14encapsulates 55% to 60% of an exterior surface area of the at least onesolar cell 12, and the backsheet 32 covers 40% to 45% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 50% to 55% of an exterior surface areaof the at least one solar cell 12, and the backsheet 32 covers 45% to50% of the exterior surface area of the at least one solar cell 12.

In an embodiment, the encapsulant 14 encapsulates 50% of an exteriorsurface area of the at least one solar cell 12 and the backsheet 32covers 50% of the exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant 14 encapsulates 55% of theexterior surface area of the at least one solar cell 12 and thebacksheet 32 covers 45% of the exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant 14 encapsulates60% of the exterior surface area of the at least one solar cell 12 andthe backsheet 32 covers 40% of the exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant 14encapsulates 65% of the exterior surface area of the at least one solarcell 12 and the backsheet 32 covers 35% of the exterior surface area ofthe at least one solar cell 12. In another embodiment, the encapsulant14 encapsulates 70% of the exterior surface area of the at least onesolar cell 12 and the backsheet 32 covers 30% of the exterior surfacearea of the at least one solar cell 12. In another embodiment, theencapsulant 14 encapsulates 75% of the exterior surface area of the atleast one solar cell 12 and the backsheet 32 covers 25% of the exteriorsurface area of the at least one solar cell 12. In another embodiment,the encapsulant 14 encapsulates 80% of the exterior surface area of theat least one solar cell 12 and the backsheet 32 covers 20% of theexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant 14 encapsulates 85% of the exterior surfacearea of the at least one solar cell 12 and the backsheet 32 covers 15%of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant 14 encapsulates 90% of the exteriorsurface area of the at least one solar cell 12 and the backsheet 32covers 10% of the exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant 14 encapsulates 95% of theexterior surface area of the at least one solar cell 12 and thebacksheet 32 covers 5% of the exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant 14 encapsulates100% of the exterior surface area of the at least one solar cell 12.

In another embodiment, the encapsulant 14 and the backsheet 32 form asingle, hybrid layer (the “encapsulant-backsheet hybrid layer”). In anembodiment, the encapsulant-backsheet hybrid layer encapsulates 50% to99.9% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates55% to 99.9% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 60% to 99.9% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant-backsheethybrid layer encapsulates 65% to 99.9% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 70% to 99.9% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 75% to99.9% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates80% to 99.9% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 85% to 99.9% of an exterior surface area of the at leastone solar cell 12. In another embodiment, the encapsulant-backsheethybrid layer encapsulates 90% to 99.9% of an exterior surface area ofthe at least one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 95% to 99.9% of anexterior surface area of the at least one solar cell 12.

In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 50% to 95% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 55% to 95% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 60% to 95% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 65% to95% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates70% to 95% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 75% to 95% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 80% to 95% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 85% to 95% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 90% to95% of an exterior surface area of the at least one solar cell 12.

In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 50% to 90% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 55% to 90% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 60% to 90% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 65% to90% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates70% to 90% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 75% to 90% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 80% to 90% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 85% to 90% of anexterior surface area of the at least one solar cell 12.

In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 50% to 85% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 55% to 85% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 60% to 85% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 65% to85% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates70% to 85% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 75% to 85% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 80% to 85% of an exterior surface area of the atleast one solar cell 12.

In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 50% to 80% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 55% to 80% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 60% to 80% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 65% to80% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates70% to 80% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 75% to 80% of an exterior surface area of the at least onesolar cell 12.

In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 50% to 75% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 55% to 75% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 60% to 75% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 65% to75% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates70% to 75% of an exterior surface area of the at least one solar cell12.

In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 50% to 70% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 55% to 70% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 60% to 70% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 65% to70% of an exterior surface area of the at least one solar cell 12.

In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 50% to 65% of an exterior surface area of the at least onesolar cell 12. In another embodiment, the encapsulant-backsheet hybridlayer encapsulates 55% to 65% of an exterior surface area of the atleast one solar cell 12. In another embodiment, theencapsulant-backsheet hybrid layer encapsulates 60% to 65% of anexterior surface area of the at least one solar cell 12. In anotherembodiment, the encapsulant-backsheet hybrid layer encapsulates 50% to60% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates55% to 60% of an exterior surface area of the at least one solar cell12. In another embodiment, the encapsulant-backsheet hybrid layerencapsulates 50% to 55% of an exterior surface area of the at least onesolar cell 12.

In an embodiment, the encapsulant-backsheet hybrid layer encapsulates50% of an exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates55% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates60% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates65% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates70% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates75% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates80% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates85% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates90% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates95% of the exterior surface area of the at least one solar cell 12. Inanother embodiment, the encapsulant-backsheet hybrid layer encapsulates100% of the exterior surface area of the at least one solar cell 12.

In an embodiment, the photovoltaic module 10 includes a Class 4 ratingwhen tested in accordance with ANSI FM 4473. In an embodiment, thefrontsheet 16 includes a fire resistance that conforms to standardsunder UL 94 test standards. In an embodiment, the frontsheet 16 includesa V-0 rating when tested in accordance with UL 94. In anotherembodiment, the frontsheet 16 includes a V-1 rating when tested inaccordance with UL 94. In another embodiment, the frontsheet 16 includesa V-2 rating when tested in accordance with UL 94. In an embodiment, thephotovoltaic module 10 is a component of a roofing/building integratedphotovoltaic system that conforms to standards under UL 790/ASTM E 108test standards. In an embodiment, the roofing/building integratedphotovoltaic system includes a Class A rating when tested in accordancewith UL 790/ASTM E 108.

In an embodiment, the photovoltaic module 10 includes a solar weightedtransmittance of 90% to 99.9%. In another embodiment, the photovoltaicmodule 10 includes a solar weighted transmittance of 91% to 99.9%. Inanother embodiment, the photovoltaic module 10 includes a solar weightedtransmittance of 92% to 99.9%. In another embodiment, the photovoltaicmodule 10 includes a solar weighted transmittance of 93% to 99.9%. Inanother embodiment, the photovoltaic module 10 includes a solar weightedtransmittance of 94% to 99.9%. In another embodiment, the photovoltaicmodule 10 includes a solar weighted transmittance of 95% to 99.9%. Inanother embodiment, the photovoltaic module 10 includes a solar weightedtransmittance of 96% to 99.9%. In another embodiment, the photovoltaicmodule 10 includes a solar weighted transmittance of 97% to 99.9%. Inanother embodiment, the photovoltaic module 10 includes a solar weightedtransmittance of 98% to 99.9%. In another embodiment, the photovoltaicmodule 10 includes a solar weighted transmittance of 99% to 99.9%. Inanother embodiment, the photovoltaic module 10 includes a solar weightedtransmittance of 80% to 99.9%. In another embodiment, the photovoltaicmodule 10 includes a solar weighted transmittance of 85% to 99.9%.

In an embodiment, the photovoltaic module 10 includes a solar weightedreflectance of 0.01% to 5%. In an embodiment, the photovoltaic module 10includes a solar weighted reflectance of 0.01% to 4%. In an embodiment,the photovoltaic module 10 includes a solar weighted reflectance of0.01% to 3%. In an embodiment, the photovoltaic module 10 includes asolar weighted reflectance of 0.01% to 2%. In an embodiment, thephotovoltaic module 10 includes a solar weighted reflectance of 0.01% to1%. In an embodiment, the photovoltaic module 10 includes a solarweighted reflectance of 0.01% to 0.5%.

The embodiments described herein are merely exemplary and that a personskilled in the art may make many variations and modifications withoutdeparting from the spirit and scope of the invention. All suchvariations and modifications are intended to be included within thescope of the invention.

What is claimed is:
 1. A photovoltaic module, comprising: at least onesolar cell; an encapsulant encapsulating the at least one solar cell,wherein a thickness of the encapsulant is 0.5 mm to 1.8 mm; and afrontsheet adjacent to the encapsulant, wherein the frontsheet includesa glass layer, wherein a thickness of the glass layer is 2.5 mm to 4 mm,a polymer layer wherein the polymer layer includes a fluoropolymerselected from the group consisting of ethylene tetrafluoroethylene(ETFE), polyvinylidene fluoride (PVDF),tetrafluoroethylene-hexafluoropropylene copolymers (FEP),tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymers(THV), polyvinyl fluoride (PVF), and blends thereof, and wherein athickness of the polymer layer is 0.01 mm to 0.5 mm, an adhesive layerdirectly adhering the glass layer to the polymer layer, wherein theadhesive layer is selected from the group consisting of thermosettingpolyolefin, thermosetting polyolefin encapsulant material, thermosettingethylene-vinyl acetate (EVA), EVA encapsulants, thermoplastic polyolefin(TPO) and hybrids and combinations thereof, wherein a thickness of theadhesive layer is 50 micrometers to 700 micrometers, and wherein theglass layer of the frontsheet is adjacent to the encapsulantencapsulating the at least one solar cell, wherein the photovoltaicmodule is configured to be installed on a roof deck, and wherein, whenthe photovoltaic module is installed on the roof deck, the polymer layeris a top layer opposite the roof deck.
 2. The photovoltaic module ofclaim 1, wherein the adhesive layer includes a thermosetting polyolefinencapsulant material.
 3. The photovoltaic module of claim 1, wherein thethickness of the polymer layer is 0.025 mm to 0.1 mm.
 4. Thephotovoltaic module of claim 1, further comprising a backsheetjuxtaposed with the encapsulant.
 5. The photovoltaic module of claim 4,wherein the backsheet includes thermoplastic polyolefin (TPO).
 6. Thephotovoltaic module of claim 1, wherein the polymer layer includesethylene tetrafluoroethylene (ETFE).
 7. The photovoltaic module of claim1, wherein the polymer layer includes polyvinylidene fluoride (PVDF). 8.The photovoltaic module of claim 1, wherein the polymer layer includestetrafluoroethylene-hexafluoropropylene copolymers (FEP).
 9. Thephotovoltaic module of claim 1, wherein the adhesive layer is selectedfrom the group consisting of thermosetting polyolefin encapsulantmaterial and EVA encapsulants.
 10. The photovoltaic module of claim 1,wherein the thickness of the encapsulant is 0.8 mm to 1.4 mm.